(Adnkronos) – SAN LUIS OBISPO, Calif., July 6, 2023 /PRNewswire/ — Revasum today announced the availability of 200mm SiC wafer polishing capability on the 6EZ platform. The 6EZ has already proven its value in high-volume manufacturing of 150mm SiC substrates and a 200mm conversion kit has now been fully tested and released, giving customers the option of upgrading 6EZ systems in the field.
Source: Adnkronos innovazione